Universal LPM Granule Adhesive for Wire Splice and Electronic Unit Sealing
Store rating:5.0
(10 reviews)
Attributes
Hot Melt AdhesivesClassification
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage
PolyamideMain Raw Material
63428-84-2CAS No.
FrancePlace of Origin
BOSTIKBrand Name
Type:Hot Melt Adhesives
Application range:Low pressure molding
Characteristics:Versatility
Raw Material:PA(Polyamide)
Features:Water Resistance
Color:Black
Certificate:ROHS, UL94V0
Samples:Accept
Packing:Waterproof plastic bag
MOQ:1 KG
Delivery Time:3-5 Working Days
Key attributes
Classification
Hot Melt Adhesives
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Main Raw Material
Polyamide
CAS No.
63428-84-2
Place of Origin
France
Brand Name
BOSTIK
Type
Hot Melt Adhesives
Application range
Low pressure molding
Characteristics
Versatility
Raw Material
PA(Polyamide)
Features
Water Resistance
Color
Black
Certificate
ROHS, UL94V0
Samples
Accept
Packing
Waterproof plastic bag
MOQ
1 KG
Delivery Time
3-5 Working Days
Packaging and delivery
Selling Units
Single item
Single package size
75X48X17 cm
Single gross weight
1.500 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
FREE shipping capped at $20
Lower tariff
1 - 19 kilograms
$1950
>= 20 kilograms
$1870
*Taxes and import charges will be calculated at checkout
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