Universal BGA Silicone Pad Insulation Mat BGA Stencil Magnetic Base for CPU IC Chip Soldering BGA Reballing
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Attributes
Mobile phonesapplication
alloymaterial
Guangdong, Chinaplace of origin
Universal Mobile Phone Repair Disassemble LCD Support FixtureProduct name
for disassemble mobile phone partsApplication
support from iphone 7 to 14 pro maxModel
keyword:lcd support fixture
Usage:mobile phone repair disassemble
Key attributes
application
Mobile phones
material
alloy
place of origin
Guangdong, China
Product name
Universal Mobile Phone Repair Disassemble LCD Support Fixture
Application
for disassemble mobile phone parts
Model
support from iphone 7 to 14 pro max
keyword
lcd support fixture
Usage
mobile phone repair disassemble
Packaging and delivery
Selling Units
Single item
Package size per batch
10X5X2 cm
Gross weight per batch
0.200 kg
Lead time
Product descriptions from the supplier
FREE shipping capped at $20
Lowest among similar
2 - 9 pieces
$240
10 - 49 pieces
$210
50 - 199 pieces
$190
>= 200 pieces
$160
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