Universal BGA Silicone Pad Insulation Mat BGA Stencil Magnetic Base for CPU IC Chip Soldering BGA Reballing

Name: Universal BGA Silicone Pad Insulation Mat BGA Stencil Magnetic Base for CPU IC Chip Soldering BGA Reballing
Brand: Guangzhou Kusulong Electronic Co., Ltd.
SKU: 1601268998710
Price: 1.6 USD
Availability: InStock

Store rating:4.8

(419 reviews)

Guangzhou Kusulong Electronic Co., Ltd.

6 yrs

Attributes

Mobile phonesapplication

alloymaterial

Guangdong, Chinaplace of origin

Universal Mobile Phone Repair Disassemble LCD Support FixtureProduct name

for disassemble mobile phone partsApplication

support from iphone 7 to 14 pro maxModel

keyword:lcd support fixture

Usage:mobile phone repair disassemble

Universal Compatibility: This BGA Silicone Pad Insulation Mat is designed for disassembling mobile phone parts, specifically supporting models from iPhone 7 to 14 Pro Max, making it an ideal tool for professionals and DIY enthusiasts alike.
Magnetic Base for Easy Handling: The product features a magnetic base that allows for effortless handling and precise placement of the BGA chip, reducing the risk of damage during the soldering process.
Durable Alloy Material: Constructed from high-quality alloy material, this insulation mat ensures durability and longevity, withstanding repeated use and heavy handling.
Silicone Pad Insulation for Safety: The silicone pad provides excellent insulation, protecting the user from electrical shock and ensuring a safe working environment during the soldering process.
Efficient BGA Reballing and Soldering: This product facilitates efficient BGA reballing and soldering, making it an essential tool for professionals and hobbyists in the mobile phone repair industry, particularly for those who want to repair their own iPhone devices.

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