Thin Film Thick Film DBC DPC AMB Aluminum Nitride AlN Substrates for Power Modules MOSFET IGBT

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Shanghai Borino Ceramics Technology Co., Ltd.

1 yr

CN

Key attributes

Material

Aluminum Nitride

Place of Origin

Shanghai, China

Brand Name

Borino

Application

Industrial Ceramic

Processing Service

Punching, Cutting, Bending, Moulding

Type

Ceramic Rods

Material

aluminium oxide, aluminium nitride, silicon nitride, beryllium oxide

Material 2

Al2o3, AlN,Si3N4,BeO

Surface finish

Ra≤0.8um;Rz≤10um;Rmax≤50um

Feature

lower thermal expansion coefficient, and greater stability

Production process

DBC AMB,AMB Active Solder Copper Process

Thickness of master substrate

0.16,0.25,0.32,0.38,0.5,0.6,0.63,0.76,0.89,1,1.5,2mm

Surface finish 2

Ni 2~10μm,Au 0. 01~0.20μm

Application

new energy vehicles,wind power, aerospace, grid-connection technology

Purity of copper

≥ 99.99

Name

active metal brazing AMB

Packaging and delivery

Selling Units

Single item

Single package size

14X9X10 cm

Single gross weight

2.000 kg

Lead time

Product descriptions from the supplier

FREE shipping capped at $20 on your first order

100 - 999 pieces

$30

>= 1000 pieces

$25

Variations

Shipping

4 interest-free payments with

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Delivery via

Expect your order to be delivered before scheduled dates or receive a 10% delay compensation

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