Thermoplastic Polyamide Hot Melt Adhesive for Underfill and Encapsulation of Electronic Units
Thermoplastic Polyamide Hot Melt Adhesive for Underfill and Encapsulation of Electronic UnitsStore rating:5.0
(10 reviews)
Attributes
Hot Melt AdhesivesClassification
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage
PolyamideMain Raw Material
63428-83-1CAS No.
Guangdong, ChinaPlace of Origin
PolymeltBrand Name
Type:Hot Melt Adhesives
Application:Low pressure molding
Raw Material:PA (Polyamide)
Features:Water Resistance
Color:Black, Amber
Certificate:ROHS, UL94V0
Samples:Accept
Key attributes
Classification
Hot Melt Adhesives
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Main Raw Material
Polyamide
CAS No.
63428-83-1
Place of Origin
Guangdong, China
Brand Name
Polymelt
Type
Hot Melt Adhesives
Application
Low pressure molding
Raw Material
PA (Polyamide)
Features
Water Resistance
Color
Black, Amber
Certificate
ROHS, UL94V0
Samples
Accept
Packaging and delivery
Selling Units
Single item
Single package size
75X48X17 cm
Single gross weight
22.000 kg
Lead time
Product descriptions from the supplier
Warning/Disclaimer
California Proposition 65 Consumer WarningView more
Minimum order quantity: 20 kilograms
$12-18
Sample price: $20
Quantity
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
$0.00 - $0.00
Shipping total
To be negotiated
Subtotal
$0.00 - $0.00
4 interest-free payments with
Alibaba.com order protection
Secure payments
Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols
Money-back protection
Claim a refund if your order doesn't ship, is missing, or arrives with product issues
Only orders placed and paid through Alibaba.com can enjoy free protection by
