TOMBO P3-03 Low Thermal Conductivity (0.044W/mK 800) Amorphous Silica Microporous Insulation Board Heat Insulation Materials
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Attributes
Amorphous silicaMaterial
Insulation BoardType
High TemperatureApplication
N/AWarranty
contact usAfter-sale Service
contact usProject Solution Capability
Design Style:contact us
Place of Origin:Japan
Brand Name:TOMBO
Model Number:p3-03
Feature:Low Thermal Conductivity
Advantage:space-saving
Size:Customized Size
Product name:ROSLIM BOARD
Thermal Conductivity:0.044W/(mK) at 800℃
Key attributes
Material
Amorphous silica
Type
Insulation Board
Application
High Temperature
Warranty
N/A
After-sale Service
contact us
Project Solution Capability
contact us
Design Style
contact us
Model Number
p3-03
Place of Origin
Japan
Brand Name
TOMBO
Application
Insulator for furnace
Feature
Low Thermal Conductivity
Advantage
space-saving
Size
Customized Size
Product name
ROSLIM BOARD
Thermal Conductivity
0.044W/(mK) at 800℃
Packaging and delivery
Selling Units
Single item
Lead time
Customization options
pls contact us (Min. order: 1 piece)
View details
Product descriptions from the supplier
Customizable
Minimum order quantity: 1 piece
$300
Quantity
Customization options
pls contact us (Min. order: 1 piece)
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
$0.00
Shipping total
To be negotiated
Subtotal
$0.00
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