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Polyamide Resin Hotmelt for High Temp PCB Underfill and Automotive Sensors

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Lamieux Electronics, LTD.
6 yrs

Attributes

63428-83-1CAS No.
FrancePlace of Origin
PolyamideMain Raw Material
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, CoilUsage
BOSTIKBrand Name
Hot Melt AdhesivesClassification
Type:Hot Melt Adhesives
Application:Low pressure molding
Raw Material:PA(Polyamide)
Features:Water Resistance
Certificate:ROHS, UL94V0
Samples:Accept
Packing:Water proof Bag
Storage:At least 24 months
Selling Units:Single item
Single package size:75X48X17 cm
Single gross weight:22.000 kg

Key attributes

CAS No.
63428-83-1
Place of Origin
France
Main Raw Material
Polyamide
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Brand Name
BOSTIK
Classification
Hot Melt Adhesives
Type
Hot Melt Adhesives
Application
Low pressure molding
Raw Material
PA(Polyamide)
Features
Water Resistance
Certificate
ROHS, UL94V0
Samples
Accept
Packing
Water proof Bag
Storage
At least 24 months

Packaging and delivery

Selling Units
Single item
Single package size
75X48X17 cm
Single gross weight
22.000 kg
Show more

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
Minimum order quantity: 20 kilograms
$13-3390
Sample price: $20

Quantity

Shipping

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Item subtotal
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Shipping total
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Subtotal
$0.00 - $0.00

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