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Original XCVM1302-1LSIVSVD1760 1760 BFBGA, FCBGA Embedded Components Electronic

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Attributes

StandardMounting Type
Electronic Chips ComponentFunctional Application
XCVM1302-1LSIVSVD1760Model Number
ChinaPlace of Origin
OriginalBrand Name
1760 BFBGA, FCBGAPackaging
Series:Embedded
Describe:IC VERSALPRIME ACAP FPGA 1760BGA
Architecture:MPU, FPGA
Core Processor:Dual ARM Cortex A72 MPCore with CoreSight
Flash Size:-
RAM Size:-
Peripherals:DDR, DMA, PCIe
Speed:400MHz, 1GHz
Primary Attributes:Versal Prime FPGA, 70k Logic Cells

Key attributes

Mounting Type
Standard
Functional Application
Electronic Chips Component
Model Number
XCVM1302-1LSIVSVD1760
Place of Origin
China
Brand Name
Original
Packaging
1760 BFBGA, FCBGA
Series
Embedded
Describe
IC VERSALPRIME ACAP FPGA 1760BGA
Architecture
MPU, FPGA
Core Processor
Dual ARM Cortex A72 MPCore with CoreSight
Flash Size
-
RAM Size
-
Peripherals
DDR, DMA, PCIe
Speed
400MHz, 1GHz
Primary Attributes
Versal Prime FPGA, 70k Logic Cells

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Easy Return
1 - 3,000 pieces
$2,74875
>= 3,001 pieces
$1,37438

Variations

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Specification

XCVM1302 1LSIVSVD1760

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