New Top Grade R0.050-R0.350mm Engineering Plastic Ejector Needle (Soft) Semicon Die Bond Machine Leader Range Hitech 3-Month
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Attributes
molding machineMachine Type
3 Monthswarranty
Not Availablemachinery test report
Not Availablevideo outgoing-inspection
Malaysiaplace of origin
0.0008weight (kg)
brand name:Leader Range Hitech
Material:Engineering Plastic
Packaging:40pcs / Box
Logistic Mode:Air Freight
Condition:New
Showroom Location:Malaysia
Applicable Industries:Semicon Die Bond Machine
Marketing Type:Machine Part
Core Components:Single component product
Key attributes
Machine Type
molding machine
warranty
3 Months
machinery test report
Not Available
video outgoing-inspection
Not Available
place of origin
Malaysia
weight (kg)
0.0008
brand name
Leader Range Hitech
Material
Engineering Plastic
Packaging
40pcs / Box
Logistic Mode
Air Freight
Condition
New
Showroom Location
Malaysia
Applicable Industries
Semicon Die Bond Machine
Marketing Type
Machine Part
Core Components
Single component product
Packaging and delivery
Selling Units
Single item
Customization options
Customized Tip Size & Optional Colour Coding (Min. order: 100 pieces)
View details
Product descriptions from the supplier
Customizable
Minimum order quantity: 100 pieces
$150-3
Quantity
Customization options
Customized Tip Size & Optional Colour Coding (Min. order: 100 pieces)
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
Item subtotal
$0.00 - $0.00
Shipping total
To be negotiated
Subtotal
$0.00 - $0.00