CONG TY TNHH HO TRO GIAO DUC VA PHAT TRIEN CONG DONG BINH MINH

VN1 yr

≤5h

Response Time

Hdi Fpc Board High Density Interconnect Flex Fine Pitch 0.3mm 0.4mm Bga Microvia Custom Factory

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$0.05

Minimum order quantity: 100 pints

Quantity

Key attributes

Base Material

Polyimide

Board Thickness

0.3-0.4mm(0.01-0.02in)

Model Number

FPC

Type

FPC

Place of Origin

China

Min. Line Spacing

2/2mil (Laser Via/Microvia)

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$0.00

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To be negotiated

Subtotal

$0.00

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Key attributes

Base Material

Polyimide

Board Thickness

0.3-0.4mm(0.01-0.02in)

Model Number

FPC

Type

FPC

Place of Origin

China

Min. Line Spacing

2/2mil (Laser Via/Microvia)

Surface Finishing

ENIG

Number of Layers

4-8 Layer

Packaging and delivery

Selling Units

Single item

Lead time

Product descriptions from the supplier

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