Electronics Component AGIB019R18A1I2V 1805 BBGA Exposed Pad Embedded BOM IC In Stock
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Attributes
AGIB019R18A1I2VModel Number
StandardMounting Type
ChinaPlace of Origin
OriginalBrand Name
Electronic Chips ComponentFunctional Application
1805 BBGA Exposed PadPackaging
Series:Embedded
Describe:IC FPGA AGILEX I 1805FBGA
Architecture:MPU, FPGA
Core Processor:Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size:-
RAM Size:256KB
Peripherals:DMA, WDT
Speed:1.4GHz
Primary Attributes:FPGA 1.9M Logic Elements
Key attributes
Model Number
AGIB019R18A1I2V
Mounting Type
Standard
Place of Origin
China
Brand Name
Original
Functional Application
Electronic Chips Component
Packaging
1805 BBGA Exposed Pad
Series
Embedded
Describe
IC FPGA AGILEX I 1805FBGA
Architecture
MPU, FPGA
Core Processor
Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Speed
1.4GHz
Primary Attributes
FPGA 1.9M Logic Elements
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
3 - 3002 pieces
$14,55308
>= 3003 pieces
$7,27654
Variations
Select nowSpecification
AGIB019R18A1I2V
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