Electronic Chips Component 2340 BFBGA Exposed Pad AGFB019R24C3E3E Embedded Authorized Distributor
Electronic Chips Component 2340 BFBGA Exposed Pad AGFB019R24C3E3E Embedded Authorized DistributorNo reviews yet
Attributes
AGFB019R24C3E3EModel Number
StandardMounting Type
ChinaPlace of Origin
OriginalBrand Name
Electronic Chips ComponentFunctional Application
2340 BFBGA Exposed PadPackaging
Series:Embedded
Describe:IC FPGA AGILEX F 2340BGA
Architecture:MPU, FPGA
Core Processor:Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size:-
RAM Size:256KB
Peripherals:DMA, WDT
Speed:1.4GHz
Primary Attributes:FPGA 1.9M Logic Elements
Key attributes
Model Number
AGFB019R24C3E3E
Mounting Type
Standard
Place of Origin
China
Brand Name
Original
Functional Application
Electronic Chips Component
Packaging
2340 BFBGA Exposed Pad
Series
Embedded
Describe
IC FPGA AGILEX F 2340BGA
Architecture
MPU, FPGA
Core Processor
Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Speed
1.4GHz
Primary Attributes
FPGA 1.9M Logic Elements
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
Easy Return
3 - 3,002 pieces
$6,57652
>= 3,003 pieces
$3,28826
Variations
Select nowSpecification
AGFB019R24C3E3E
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