Components Electronic 560 LBGA Exposed Pad, Metal XCV2000E-8BG560C Embedded BOM IC In Stock
Store rating:5.0
(2 reviews)
Attributes
Surface MountMounting Type
Electronic Chips ComponentFunctional Application
XCV2000E-8BG560CModel Number
ChinaPlace of Origin
OriginalBrand Name
560 LBGA Exposed Pad, MetalPackaging
Series:Embedded
Describe:IC FPGA 404 I/O 560MBGA
Number of LABs/CLBs:9600
Number of Logic Elements/Cells:43200
Total RAM Bits:655360
Number of I/O:404
5Chips Tech Limited
HK1 yr on Alibaba.com
5/5.0(2 reviews)Reorder rate: 12%Response Time ≤ 4hOn-time delivery rate ≥ 92%
Main markets: Taiwan China, Hong Kong SAR China, Kazakhstan, Denmark, United States
Key attributes
Mounting Type
Surface Mount
Functional Application
Electronic Chips Component
Model Number
XCV2000E-8BG560C
Brand Name
Original
Place of Origin
China
Packaging
560 LBGA Exposed Pad, Metal
Series
Embedded
Describe
IC FPGA 404 I/O 560MBGA
Number of LABs/CLBs
9600
Number of Logic Elements/Cells
43200
Total RAM Bits
655360
Number of I/O
404
Packaging and delivery
Selling Units
Single item
Package size per batch
1X1X1 cm
Gross weight per batch
0.100 kg
Lead time
Product descriptions from the supplier
1 - 3,000 pieces
$0.60
>= 3,001 pieces
$0.30
Variations
Select nowSpecification
XCV2000E 8BG560C
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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