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Authorized Distributor Electronic Chips Component XCVM1302-1LSENBVB1024 1024 BFBGA Embedded

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Attributes

XCVM1302-1LSENBVB1024Model Number
StandardMounting Type
ChinaPlace of Origin
OriginalBrand Name
Electronic Chips ComponentFunctional Application
1024 BFBGAPackaging
Series:Embedded
Describe:IC VERSALPRIME ACAP FPGA 1024BGA
Architecture:MPU, FPGA
Core Processor:Dual ARM Cortex A72 MPCore with CoreSight
Flash Size:-
RAM Size:-
Peripherals:DDR, DMA, PCIe
Speed:400MHz, 1GHz
Primary Attributes:Versal Prime FPGA, 70k Logic Cells
Selling Units:Single item
Single package size:1X1X1 cm
Single gross weight:0.100 kg

Key attributes

Model Number
XCVM1302-1LSENBVB1024
Mounting Type
Standard
Place of Origin
China
Brand Name
Original
Functional Application
Electronic Chips Component
Packaging
1024 BFBGA
Series
Embedded
Describe
IC VERSALPRIME ACAP FPGA 1024BGA
Architecture
MPU, FPGA
Core Processor
Dual ARM Cortex A72 MPCore with CoreSight
Flash Size
-
RAM Size
-
Peripherals
DDR, DMA, PCIe
Speed
400MHz, 1GHz
Primary Attributes
Versal Prime FPGA, 70k Logic Cells

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

3 - 3002 pieces
$1,96239
>= 3003 pieces
$98120

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