Amaoe BGA Reballing0.12mmCPU Repair Mold For Version Qualcomm MTK MQ1 SDM660/710/845 A/MT6771/6739/6763V Solder Mesh
Store rating:4.7
(179 reviews)
Attributes
Diygrade
OEMcustomized support
/warranty
amaoemodel number
amaoebrand name
Guangdong, Chinaplace of origin
Product Name:BGA Reballing Stencil For MQ1 SDM660/710/845 A/MT6771/6739/6763V
keyword:For MQ1 SDM660/710/845 A/MT6771/6739/6763V CPU Tin Mesh Repair
Application:Phone Repair Reballing Stencil
Thickness:0.12mm
Used for iphone:Support
Key attributes
grade
Diy
customized support
OEM
warranty
/
model number
amaoe
brand name
amaoe
place of origin
Guangdong, China
Product Name
BGA Reballing Stencil For MQ1 SDM660/710/845 A/MT6771/6739/6763V
keyword
For MQ1 SDM660/710/845 A/MT6771/6739/6763V CPU Tin Mesh Repair
Application
Phone Repair Reballing Stencil
Thickness
0.12mm
Used for iphone
Support
Packaging and delivery
Selling Units
Single item
Single package size
10X10X5 cm
Single gross weight
0.020 kg
Lead time
Product descriptions from the supplier
FREE shipping capped at $20
2 - 199 pieces
$175
200 - 499 pieces
$159
500 - 999 pieces
$137
>= 1,000 pieces
$119
*Taxes and import charges will be calculated at checkout
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