ADAU1860BCBZRL Original Interface 56 BUMP WAFER LEVEL CHIP SCALE P Electronic Components China 56 UFBGA, WLCSP
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Attributes
ADAU1860BCBZRLModel Number
Surface MountMounting Type
ChinaPlace of Origin
OriginalBrand Name
CODECSFunctional Application
56 UFBGA, WLCSPPackaging
Series:Interface
Describe:56 BUMP WAFER LEVEL CHIP SCALE P
Data Interface:I2C, I2S, SPI
Resolution (Bits):24 b
Number of ADCs / DACs:3 / 1
Key attributes
Model Number
ADAU1860BCBZRL
Mounting Type
Surface Mount
Place of Origin
China
Brand Name
Original
Functional Application
CODECS
Packaging
56 UFBGA, WLCSP
Series
Interface
Describe
56 BUMP WAFER LEVEL CHIP SCALE P
Data Interface
I2C, I2S, SPI
Resolution (Bits)
24 b
Number of ADCs / DACs
3 / 1
Packaging and delivery
Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg
Lead time
Product descriptions from the supplier
1 - 4,999 pieces
$840
>= 5,000 pieces
$457
Variations
Select nowSpecification
ADAU1860BCBZRL
Shipping
Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.
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