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2340 BFBGA Exposed Pad AGFD019R24C3E3E Embedded Components Electronic BOM IC In Stock

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Attributes

NEWManufacturing Date Code
ChinaPlace of Origin
TrayPackaging Type
Ic Electronic ComponentsApplication
Integrated Circuit Ic ChipsFeatures
StandardOutput Type
Product Status:Active
Architecture:MPU, FPGA
Core Processor:Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size:-
RAM Size:256KB
Peripherals:DMA, WDT
Speed:1.4GHz

Key attributes

Manufacturing Date Code
NEW
Place of Origin
China
Packaging Type
Tray
Application
Ic Electronic Components
Features
Integrated Circuit Ic Chips
Output Type
Standard
Product Status
Active
Architecture
MPU, FPGA
Core Processor
Quad ARM Cortex A53 MPCore with CoreSight, ARM NEON, Floating point
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Speed
1.4GHz

Packaging and delivery

Selling Units
Single item
Single package size
1X1X1 cm
Single gross weight
0.100 kg

Lead time

Product descriptions from the supplier

Warning/Disclaimer
California Proposition 65 Consumer Warning
3 - 3002 pieces
$7,305.55
>= 3003 pieces
$3,652.77

Variations

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